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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/18 tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 14 ? 001 automotive ips series 1ch high-side switch bd1hx500 series features built-in overcurrent protection circuit built-in thermal shut down(tsd) built-in open load detection circuit(when output is off) possibility to control direct ly from cmos logic ic low standby current built-in under voltage lock out circuit built-in diagnostic(st) output function low on resistance of r ds(on) =500m ? (typ) (v dd =12v, ta=25c, io=0.25a) monolithic power ic that has a built in control part (cmos) and a power mos fet on 1chip 1ch high-side switch for the mechanical relay coil drive aec-q100 qualified (1) (1) grade 1 general description bd1hc/d500 series is an automotive 1ch high-side switch. it has a built-in overcurrent protection circuit, thermal shut down (tsd) circuit, open load detection circuit, under voltage lock out circuit, and has diagnostic (st) output function at the time during abnormal detection. application for automotive (air conditioner, body equipment, and meter, etc.) product summary operating voltage 4v to 18v on-state resistance (25c, typ) 500m ? overcurrent limit (typ) 1.45a active clamp energy (25c) 33mj package htsop-j8 4.90mm x 6.00mm x 1.00mm hson8 2.90mm x 3.00mm x 0.60mm msop8 2.90mm x 4.00mm x 0.90mm typical application circuit msop 8 hson 8 htsop-j8 datashee t downloaded from: http:///
datasheet d a t a s h e e t 2/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 1.in 2.gnd 3.out 4.out 5. v dd 6. v dd 7. n.c 8. st pin descriptions pin symbol function 1 in input terminal. the pull-down re sistor is internally connected. 2 gnd earth terminal. 3, 4 out output terminal. when the load becomes in a short-circuit state and if the current exceeds overcurrent detection value of 0. 8a (min) the current flowing in the output pin will be limited due ic protection. 5, 6 v dd power-supply terminal. 7 n.c n.c 8 st self-diagnostic output terminal. "l" is bec omes the output state during overcurrent, overheating and open load detection conditions. please refer to diagnostic output truth tabl e on page 5. the circuit is composed of an open drain n channel mos. cooling tab (1) tab since it has connected with sub of ic, please connect the heat dissipation metal to external gnd potential. (htsop-j8,hson8) (1)msop8 does not have cooling tab. pin configurations product line-up product name pkg tsd function on-state resistance (25c, typ) bd1hc500efj-c htsop-j8 off-latch 500m ? bd1hc500hfn-c hson 8 bd1hc500fvm-c msop 8 bd1hd500efj-c htsop-j8 self-restart BD1HD500HFN-C hson 8 bd1hd500fvm-c msop 8 htsop-j8 (top view) 1.in 2.gnd 3.out4.out 5. v dd 6. v dd 7. n.c 8. st hson8 (top view) 1.in 2.gnd 3.out 4.out 5. v dd 6. v dd 7. n.c 8. st msop8 (top view) downloaded from: http:///
datasheet d a t a s h e e t 3/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol rating unit voltage between drain and source v ds 44.5 (internal limitation) v power supply voltage v dd 40 v input voltage v in -0.3 to +12 (1) v diagnostic output voltage v st -0.3 to +15 (1) v output current (dc) i od 0.8 (2) a output current (pulse) i op internal limitation (3) a diagnostic output current i st 1 ma power consumption p d 2.100 (htsop-j8) (4) 1.750(hson 8) (5) w 0.587 (msop 8) (6) operating temperature range t opr -40 t opr < +150 c storage temperature range t stg -55 to +150 c maximum junction temperature t jmax 150 c active clamp energy (single pulse) e av 33 mj operating voltage ratings parameter symbol rating unit operating voltage v dd 4 to 18 v (1) however, v dd v in (2) however, exceed neither pd nor aso. (3) because of overcurrent protection circuit. (refer to p11 figure 20) (4) ic mounted on rohm standard board (70701.6[mm] , copper area 7070[mm], glass epoxy 2 layer board). derate by 16.8mw above 25c (5) ic mounted on rohm standard board (70701.6[mm], copper area 7070[mm], glass epoxy 2 layer board). derate by 14.0mw above 25c (6) ic mounted on rohm standard board (70701.6[mm] , copper area 7070[mm], glass epoxy 1 layer board). derate by 4.7mw above 25c. heat dissipation characteristic (htsop-j8) (1)ic mounted on rohm standard board (70701.6[mm], c opper area 7070[mm], glass epoxy 4 layer board). derate by 30mw/c above 25c. (2)ic mounted on rohm standard board (70701.6[mm], copper area 7070[mm], glass epoxy 2 layer board). derate by 16.8mw/c above 25c. (hson 8) (3)ic mounted on rohm standard b oard (70701.6[mm], c opper area 7070[mm], glass epoxy 2 layer board). derate by 14.0mw/c above 25c. (msop 8) (4)ic mounted on rohm standard b oard (70701.6[mm],copper area 7070[mm], glass epoxy 1 layer board). derate by 4.7mw/c above 25c. 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 0 25 50 75 100 125 150 ta [c] pd [w] 0.587 w 2.100 w 3.750 w (1) htsop-j8 (2) htsop-j8 (4) msop8 1.750 w (3) hson8 (1) htsop-j8(glass epoxy 4 layer board) (2) htsop-j8(glass epoxy 2 layer board) (3) hson8 (glass epoxy 2 layer board) (4) msop8 (glass epoxy 1 layer board) downloaded from: http:///
datasheet d a t a s h e e t 4/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified, v dd =4v to 18v, -40c t j +150c) parameter symbol target value unit conditions min typ max [power supply block] standby current i dds1 - 0.1 10 a v dd =12v,v in =0v, v out =0v,tj=25c i dds2 - - 220 a v dd =12v,v in =0v, v out =0v,tj=150c operating current i dd - 1.5 3.0 ma v dd =12v,v in =5v v out =open under voltage lock out (uvlo) threshold v uvlo - 3.0 3.6 v [input block] h level input voltage v in(h) 3.0 - - v l level input voltage v in(l) - - 1.0 v input hysteresis v in(hys) - 0.3 - v h level input current i in(h) - 50 100 a v in =5v l level input current i in(l) -10 - 10 a v in =0v [power mos output] output on resistance r ds(on) - 500 650 m ? v dd =12v,i out =0.25a,tj=25c r ds(on) - 900 1200 m ? v dd =12v,i out =0.25a,tj=150c output leak current i l(off) - - 5 a v in =0v, tj=25c i l(off) - - 200 a v in =0v, tj=150c switching time t on - 13 25 s v dd =12v ,r l =47 ? ,tj=25c figure16 t off - 9 25 s v dd =12v ,r l =47 ? ,tj=25c figure16 slew rate on dv/dt on - 3 6 v/ s v dd =12v ,r l =47 ? ,tj=25c figure16 slew rate off -dv/dt off - 3 6 v/ s v dd =12v ,r l =47 ? ,tj=25c figure16 output clamp voltage v cl -8 -6.0 -4.5 v v in =0v,i out =100ma figure17 [diagnostic output] diagnostic output voltage l level v stl - - 0.4 v v in =5v,i st =0.1ma diagnostic output current h level i sth - - 10 a v in =0v,v st =12v downloaded from: http:///
datasheet d a t a s h e e t 5/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified, v dd =4v to 18v, -40c t j 150c) parameter symbol target value unit conditions min typ max [protect circuit] overcurrent protection i lim 0.8 1.45 2.0 a diagnostic output delay time(ocp) on t dhl - 20 100 s diagnostic output delay time(ocp) figure20 off t dlh - 100 200 s v dd =12v, r l = to 4 ? figure 20 open load detection threshold (1) v open 1.3 2.8 4.0 v v in =0v open load detection delay time t open 100 300 1000 s v in =5v to 0v figure21 (1) in order to detect the voltage, an external resistance (r ext ) of 130k ? (typ) is required between v dd and out pins. at worst condition, the following resistance is recommended. v dd rext 12 v under 200k ? 6 v under 50k ? 5 v under 25k ? terms figure 1. terms v dd st in out gnd 100k 5v vdd=12v rext 130k downloaded from: http:///
datasheet d a t a s h e e t 6/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 measuring circuit figure 3. switching time measuring circuit figure 2. r on measuring circuit figure 4. output clamp voltage measuring circuit figure 5. open load detection threshold measuring circuit vdd out in gnd r l =47 v in =0v/5v v dd =12v v out vdd out in gnd i out =0.25a v in =5v v dd =12v r ds(on) =(v dd -v out )/i out vdd out in gnd i o =ma v dd =12v v cl v dd st in out gnd 100k 5v v dd =12v rext v st v op en 5v to 0v downloaded from: http:///
datasheet d a t a s h e e t 7/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 diagnostic output truth table v in tj output mode v st output state v out i out h tj 175c (typ) - i out < 1.45a(typ) normal h on i out 1.45a(typ) overcurrent protect l off (1) tj > 175c (typ) - - overheating protect l off (1) l - h (over 2.8v(typ)) - open protect l off (1) l - stand by h off (1) (1)off : 130k (typ) is built in between out and gnd. downloaded from: http:///
datasheet d a t a s h e e t 8/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (unless otherwise specified, v dd =12v, v in =5v, tj=25c) figure 6. output on resistance characteristic [temperature characteristic] figure 7. output on resistance characteristic [power supply voltage characteristic] figure 8. standby current characteristic (v in =0v) figure 9. input current characteristic 0 200 400 600 800 1000 1200 -50 -25 0 25 50 75 100 125 150 tj [c] r ds( on) [m ? ] 0 200 400 600 800 1000 1200 4 6 8 10 12 14 16 18 v dd [v] ron [m ? ] (1) 0.0 2.0 4.0 6.0 8.0 10.0 4 6 8 10 12 14 16 18 v dd [v] i dds [a] 0 50 100 150 200 250 300 024681 01 2 v in [v] i in [a] tj=150c tj=25c tj=-40c (1)since the reference voltage of a charge pump circuit changes at the time of reduced voltage, on resistance changes about 3% in the 6.5v neighborhood. downloaded from: http:///
datasheet d a t a s h e e t 9/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (unless otherwise specified, v dd =12v, v in =5v, tj=25c) figure 10. switching time (t on )[temperature characteristic] figure 11. switching time (t off )[temperature characteristic] figure 12. slew rate on [temperature characteristic] figure 13. slew rate off [temperature characteristic] 0.0 5.0 10.0 15.0 20.0 25.0 -50 -25 0 25 50 75 100 125 150 tj [c] t on [ s] 0.0 5.0 10.0 15.0 20.0 25.0 -50-25 0 25 50 75100125150 tj [c] t off [ s] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 -25 0 25 50 75 100 125 150 tj [c] dv/dt on [v/ s] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50-25 0 25 50 75100125150 tj [c] -dv/dt off [v/ s] downloaded from: http:///
datasheet d a t a s h e e t 10/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (unless otherwise specified, v dd =12v, v in =5v, tj=25c) switching time measuring active clamp energy timing chart 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 -50 -25 0 25 50 75 100 125 150 tj [ ] v in [] on threshold off threshold figure 14. input voltage threshold characteristic figure 15. output leak current [temperature characteristic] v in = 0v figure 17. active clamp energy timing chart figure 16. switching time 0 5 10 15 20 25 30 -50-250 255075100125150 tj [c] i out [ a] v in v st v out i out t tt t t on t off v cl input voltage error flag output voltage output current downloaded from: http:///
datasheet d a t a s h e e t 11/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 protect function timing chart figure 18. bd1hc500 off-latch overheat protection timing chart figure 20. overcurrent protect timing chart figure 19. bd1hd500 self-restart overheat protection timing chart figure 21. open load detection timing chart t t t t 12.5 s(t yp) input voltage chip temperature tj output current error flag v st i out v in input voltage chip temperature tj output current error flag v st t t t t i out v in 12.5 s(t yp) v in vout v st input voltage output voltage error flag t t t 300 s(typ) vout ? 2.8v(typ) (v open ) (t open ) v in o i out v st 20 s(typ) (t dhl ) 1ms(typ) t t t t 100 s(typ) (t dlh ) i ocp input voltage output voltage output current error flag downloaded from: http:///
datasheet d a t a s h e e t 12/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuits pin symbol i/o equivalence circuits 1 in 2 gnd 3, 4 5, 6 out v dd v dd 130k (typ) gnd out 8 st cooling tab tab downloaded from: http:///
datasheet d a t a s h e e t 13/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information bd1hx500fvm - ctr series pkg efj: htsop-j8 hfn:hson8 fvm: msop8 packaging and forming specification e2:embossed tape and reel (htsop-j8) tr:embossed tape and reel (msop 8,hson 8) c: high reliability c:tsd off-latch d:tsd self-restart marking diagram msop8 (top view) hx5 part number marking lot number 1pin mark 0 0 htsop-j8 (top view) hx500 part number marking lot number 1pin mark hson8 (top view) 00 part number marking lot number 1pin mark hx5 downloaded from: http:///
datasheet d a t a s h e e t 14/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension tape and reel information package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t 15/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 package name hson8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet d a t a s h e e t 16/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 package name msop8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet d a t a s h e e t 17/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings operating the ic over the absolute maximum ratings may dama ge the ic. in addition, it is impossible to predict all destructive situations such as short-circuit modes or open ci rcuit modes. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is expected to be operated in a special mode exceeding the absolute maximum ratings. 2) reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. 3) power supply line design the pcb layout pattern to provide low impedance ground and supply lines. separate the ground and supply lines of the digital and analog blocks to pr event noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to gr ound at all power supply pins. consider the effect of temperature and aging on the capacitance va lue when using electrolytic capacitors. 4) gnd voltage the voltage of the ground pin must be the lowest voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5) thermal consideration use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. 6) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. 7) tsd (thermal shut down) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn off the ic when the internal temperature of the ic reaches a 175c (with 25c hysteresis). it is not designed to protect the ic from damage or guarantee its operation. do not continue to operate the ic after this function is activated. do not use the ic in conditions where this function will always be activated. 8) overcurrent protection circuit (ocp) the ic incorporates an over-current protection circuit that operates in accordance with the rated output capacity. this circuit protects the ic from damage when the load becomes shorted. it is also designed to limit the output current (without latching) in the event of more than 1.45a (typ) current flow, such as from a large capacitor or other component connected to the output pin. this protection circuit is effe ctive in preventing damage to the ic in cases of sudden and unexpected current surges. the ic should not be used in applic ations where the over current protection circuit will be activated continuously. st (8 pin) will be set to l (abnormal condition) if the current limit state continues to 20 s(typ). then, st (8 pin) will be set to h (normal condition) if the current limit release until 1.1ms(typ). if current limit state continues, generation of heat, degradation, etc. of the ic can be considered. when the state of overcurrent still flows, compensate by setting the ic in standby mode applications using st (8 pin). 9) testing on application boards when testing the ic on an application board, connecting a capa citor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10) regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction op erates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 11) fin (htsop-j8,hson 8) since it has connected with sub of ic, please connect the heat dissipation metal to external gnd potential. status of this document the japanese version of this document is the formal datas heet. a customer may use this translation version only as reference to help understand the formal version. if there are any differences, the formal version takes precedence. downloaded from: http:///
datasheet d a t a s h e e t 18/18 bd1hx500 series tsz02201-0g3g0bd00070-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.15 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 20.sep.2013 001 new release 15.apr.2015 002 ? p1. aec-q100 qualified is added in features ? p1. product summary modify ? p1. typical application circuit change from v dd to vbat ? p2. pin descriptions change from fin to cooling tab and add note(1) ? p3. absolute maximum ratings delete ta ? p3. operating voltage ratings change note(1) content ? p5. electrical characteristics modify circuit figure of note(1) ? p7. diagnostic output truth table modify ? p11 . change from sec to s at protect function timing chart ? p12 . i/o equivalence circuits add cooling tab downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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